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YieldWatchDog™
EQUIPMENT MONITORING MODULE
Equipment Monitoring Module allows the control of specific tools using product test data.
Equipment Monitoring Module can also be used for control of test and probing equipment, allowing
fast detection e.g. of probe card degradation.
Equipment Monitoring Module will detect any statistical significant difference in the performance of
similar tools thus making it the ideal control software for new equipment ramp-up.
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Trend of test parameter with a simulated
equipment degradation of tool LIT2…
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…observed with YieldWatchDog™
Equipment Monitoring Module.
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YieldWatchDog™
SPATIAL SIGNATURE CONTROL MODULE
The Spatial Signature Control (SSC) Module allows monitoring and early detection of equipment
specific spatial signatures among wafer test data.
Long before equipment-characteristic spatial signatures are visible on wafer bin maps, they can be
detected by the SSC Module, which looks closely on the spatial distributions of the underlying
parameters.
Thus, specific tool degradations can be detected at an early stage, enabling timely counteraction.
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Development of a ring-shaped signature on wafer maps of 60 lots, including noise. While the
human observer may notice the signature at about lot #50, the SSC Module detects it at lot #20.
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YieldWatchDog™
ADVANCED QUALITY MODULE
The Advanced Quality Module (AQM) identifies ICs that pass test limits but show suspicious deviation
from the performance of the majority of tested parts.
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Designed especially for use in quality critical areas, the identification of quality compromised ICs goes
beyond "part average testing", because we use a model-free approach (there is no
normal-distribution assumption).
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